|
Titel:
|
|
Impact of materials on back-contact module reliability
|
|
|
|
Auteur(s):
|
|
|
|
|
|
Gepubliceerd door:
|
Publicatie datum:
|
|
ECN
Zonne-energie
|
21-6-2010
|
|
|
|
ECN publicatienummer:
|
Publicatie type:
|
|
ECN-M--10-028
|
Conferentiebijdrage
|
|
|
|
Aantal pagina's:
|
Volledige tekst:
|
|
4
|
Download PDF
(223kB)
|
Gepresenteerd op: 35th IEEE Photovoltaic Specialist Conference, Honolulu, USA, 20-25 juni 2010.
Samenvatting:
This paper discusses the impact of several combinations of encapsulants, conductive adhesives and back-sheet foils on ECN’s back-contact modules performance and reliability. Damp-heat (85°C; 85% R.H) and thermal cycling (-40°C; +85°C) tests were performed up to twice as long as described in the IEC-61215 standard, i.e. 2000 hours of damp-heat and 400 thermal cycles. These tests have been identified as the most important tests for this technology. After climatic chamber testing, the modules were analyzed visually and by electro-luminescence imaging.
Terug naar overzicht.