| Titel: | 
        
            | Crystal-orientation dependence of surface recombination velocity forsilicon nitride passivated silicon wafers | 
        
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            | Auteur(s): | 
        
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            | Gepubliceerd door: | Publicatie datum: | 
        
            | ECN | 1996 | 
        
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            | ECN publicatienummer: | Publicatie type: | 
        
            | ECN-RX--96-019 | Overig | 
        
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            | Aantal pagina's: | Volledige tekst: | 
        
            | 6 | Niet beschikbaar. | 
    
    
    
        Samenvatting:
        The crystal-orientation dependence of the surface recombination velocityfor silicon nitride coated silicon wafers is investigated and compared with
thermal oxides. A qualitative very similar orientation dependence of
Seff,d(deltan) for thermal oxide and PECVD nitride coated p-Si wafers
etched in diluted HF is found with Seff,d(deltan) (100)<(110)<(111).
The type of HF-etch (diluted or buffered HF) prior to deposition has a large
influence on Seff,d(deltan) for the nitride coated p-Si wafers. For
the nitride coated n-Si wafers etched in diluted HF no orientation dependence
of Seff,d(deltan) is observed. 2 figs., 1 tab., 15 refs.
    
    
        
        
    
    
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