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ECN publicatie:
Low-stress interconnection for solar cells
Gepubliceerd door: Publicatie datum:
ECN Zonne-energie 1-6-2005
ECN publicatienummer: Publicatie type:
ECN-RX--05-006 Conferentiebijdrage
Aantal pagina's: Volledige tekst:
4 Download PDF  (141kB)

Gepresenteerd op: 20th European Photovoltaic Solar Energy Conference and Exhibition, Barcelona, Spain, 6-10 juni 2005.


Standard soldering techniques applied to large and thin silicon solar cells can lead to cell breakage because of mechanical stresses. Several alternative stress-free interconnection technologies have been explored: mechanical contacting and physical joining by means of electrically conductive adhesives. A mechanical contacting technology relying purely on contact pressure exerted by magnets was investigated. This technology is truly stress-free because there is no means of physical joining of the tabs with the cell. Durable contacts can be manufactured using this technique. It was shown however, that this method does not give reliable results after EVA encapsulation. The EVA encapsulant underflows the tab which leads to unstable contact resistances. Interconnection with conductive adhesives performs excellently. Recent development of flexible conductive adhesives has greatly increased the reliability of the adhesive bond. Low process temperatures lead to low-stress interconnections with excellent mechanical properties, conductivity and durability.

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