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ECN publicatie:
Impact of materials on back-contact module reliability
Gepubliceerd door: Publicatie datum:
ECN Zonne-energie 21-6-2010
ECN publicatienummer: Publicatie type:
ECN-M--10-028 Conferentiebijdrage
Aantal pagina's: Volledige tekst:
4 Download PDF  (223kB)

Gepresenteerd op: 35th IEEE Photovoltaic Specialist Conference, Honolulu, USA, 20-25 juni 2010.

This paper discusses the impact of several combinations of encapsulants, conductive adhesives and back-sheet foils on ECN’s back-contact modules performance and reliability. Damp-heat (85°C; 85% R.H) and thermal cycling (-40°C; +85°C) tests were performed up to twice as long as described in the IEC-61215 standard, i.e. 2000 hours of damp-heat and 400 thermal cycles. These tests have been identified as the most important tests for this technology. After climatic chamber testing, the modules were analyzed visually and by electro-luminescence imaging.

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